
Sreekant Narumanchi
Group Manager - Advanced Power Electronics and Electric Machines
Sreekant.Narumanchi@nrel.gov
303-275-4062
https://orcid.org/0000-0001-5337-6069
Sreekant Narumanchi leads NREL's power electronics and electric machines research, which focuses on systems for electric-drive vehicles that control the flow of electricity between the battery, motor, and other powertrain components. His areas of expertise include thermal management and reliability for power electronics and electric machines; development and thermal characterization of cooling technologies; and thermal, thermomechanical, and reliability modeling and characterization of interconnects, interfaces, and interface materials for power electronics packaging applications.
Research Interests
Heat transfer
Power electronics and electric motor thermal management
Packaging and reliability
Education
Ph.D., Mechanical Engineering, Carnegie Mellon University
M.S., Mechanical Engineering, Washington State University
B.Tech., Mechanical Engineering, Indian Institute of Technology
Awards and Honors
Fellow, American Society of Mechanical Engineers (ASME) (2020)
General Chair, ASME InterPACK Conference (2019)
ASME Electronic and Photonic Packaging Division-K16 Clock Award (2018)
R&D 100 Award Wolfspeed Wide Bandgap Automotive Traction Inverter (2016)
ASME InterPACK Conference, Outstanding Paper Award (2013)
NREL Outstanding Business Collaboration Award (2013)
ASME Journal of Electronic Packaging Best Paper Award (2003)
Scientific Advisory Board, National Science Foundation Engineering Research Center, Power Optimization of Electro-Thermal Systems (three-year appointment)
Reviewer for the U.S. Department of Energy and several journals
Associate Editor, ASME Journal of Electronic Packaging
Featured Work
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions, Journal of Electronic Packaging (2022)
The Rise of Electric Vehicles—2020 Status and Future Expectations, Progress in Energy (2021)
Modeling Needs for Power Semiconductor Devices and Power Electronics Systems, NREL Conference Paper (2020)
Ultracompliant Heterogeneous Copper−Tin Nanowire Arrays Making a Supersolder, Nano Letters (2018)
Guest Editorial: Special Section on InterPACK 2017-Part 1, Journal of Electronic Packaging (2018)
Guest Editorial: Special Section on InterPACK 2017-Part 2, Journal of Electronic Packaging (2018)
Chemically Linked Metal-Matrix Nanocomposites of Boron Nitride Nanosheets and Silver as Thermal Interface Materials, Nanotechnology (2018)
Experimental Characterization and Modeling of Thermal Resistance of Electric Machine Lamination Stacks, International Journal of Heat and Mass Transfer (2018)
Metallic Nanocomposites as Next-Generation Thermal Interface Materials, ITherm Conference (2017)
Local-Scale Simulations of Nucleate Boiling on Micrometer Featured Surfaces. Preprint. ASME Summer Heat Transfer Conference (2017)