Photo of Sreekant Narumanchi

Sreekant Narumanchi

Group Manager - Advanced Power Electronics and Electric Machines

Orcid ID

Sreekant Narumanchi leads NREL's power electronics and electric machines research, which aims to overcome the most challenging technical barriers to the commercialization of clean-energy technologies. The group, which has collaborated with more than 75 industry partners, universities, national laboratories, federal agencies, and other research institutions over the last 20 years, is focused on electro-thermal, thermal-fluids, thermo-mechanical, and reliability aspects of power electronics and electric machines for electric-drive vehicles, in addition to several energy efficiency and renewable energy applications.

Sreekant’s areas of expertise include thermal management and reliability for power electronics and electric machines; development and thermal characterization of cooling technologies; and thermal, thermomechanical, and reliability modeling and characterization of interconnects, interfaces, and interface materials for power electronics packaging applications. He is an American Society of Mechanical Engineers (ASME) Fellow, an Institute of Electrical and Electronics Engineers (IEEE) Senior Member, and has published over 115 peer-reviewed journal and conference papers and book chapters.

Research Interests

Heat transfer

Fluid dynamics

Multiphase flows

Electronics cooling/thermal management

Power electronics and electric machines thermal management

Power electronics packaging

Power electronics packaging reliability


Ph.D., Mechanical Engineering, Carnegie Mellon University

M.S., Mechanical Engineering, Washington State University

B.Tech., Mechanical Engineering, Indian Institute of Technology

Awards and Honors

Avram Bar-Cohen Memorial Medal, ASME (2023)

THERMI Award, SEMI-THERM Educational Foundation (2022)

ASME Fellow (2019)

Associate Editor of the Year, ASME Journal of Electronic Packaging (2019)

Clock Award, ASME Electronic and Photonic Packaging Division (2018)

R&D 100 Award with Wolfspeed, Toyota, and the University of Arkansas, R&D Magazine (2016)

Outstanding Paper Award, ASME InterPACK Conference (2013)

Outstanding Business Collaboration Award, NREL (2013)

Outstanding Performance Award, NREL (2009)

Best Paper Award, ASME Journal of Electronic Packaging (2003)

Associations and Memberships

Associate Editor, ASME Journal of Electronic Packaging (2018–2024)

Associate Editor, IEEE Components, Packaging and Manufacturing Technologies Journal (2023–2027)

Vice Chair, ASME Electronic and Photonic Packaging Division Executive Committee (2023–2024); Chair (2024–2025)

Chair, IEEE Electronic Packaging Society Thermal Mechanical Technical Committee (2023–2025)

Committee Member, ASME McDonalds Mentoring Award (2024–2026)

Scientific Advisory Board Member, National Science Foundation Engineering Research Center, Power Optimization of Electro-Thermal Systems (2019–2023)

External Advisory Board, School of Mechanical and Materials Engineering, Washington State University (2021–2023)

General Chair, ASME InterPACK Conference (2019)

Featured Work

Silicon Carbide Inverter For Off-Road Heavy-Duty Applications: The Importance of Thermal and Thermomechanical Design in Power Electronics Packaging, IEEE Electrification Magazine (2023)

Single-Phase Jet Impingement Cooling of an Automotive Silicon Carbide Power Module, IEEE Transactions on Components, Packaging and Manufacturing Technologies Journal (2023)

Multiscale Electrothermal Design of an MMC for Medium-Voltage Grid-Tied Applications, IEEE Transactions on Industry Applications (2023)

Techno-Economic Analysis of an Extreme Heat Flux Micro-Cooler, iScience (2023)

Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics, IEEE Transactions on Power Electronics (2022)

Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling, IEEE Journal of Emerging and Selected Topics in Power Electronics (2021)

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions, ASME Journal of Electronic Packaging (2021)

Experimental and Numerical Study of Heat Transfer Characteristics of Single-Phase Free-Surface Fan Jet Impingement With Automatic Transmission Fluid, International Journal of Heat and Mass Transfer (2021)

Modeling and Analysis of Future Gallium Oxide Power Semiconductor Devices, ECS Journal of Solid State Science and Technology (2019)

Experimental Characterization and Modeling of Thermal Resistance of Electric Machine Lamination Stacks, International Journal of Heat and Mass Transfer (2019)


Jet Impingement Manifolds for Cooling Power Electronics Modules, U.S. Patent No. 11,751,365 B2 (2023)

Heat Flux Micro Coolers Having Multi-Stepped Features and Fluid Wicking, U.S. Patent No. 11,729,951 B2 (2023)

A Novel SiO Hardmask to Si Pattern Transfer Method for Microfabrication of Micro-to-Mesoscale, High-Aspect-Ratio, Multi-Level, 3D Structures, Non-Provisional Patent Application 18/084303 (filed 2023)

Power Electronics Module With Integrated Ceramic Heat Exchanger, Non-Provisional Patent Application 63/483,041 (filed 2023)

Fluid-Cooled Heat Sink for Use in Cooling Various Devices, U.S. Patent No. 9,759,493 B1 (2017)

Fluid-Cooled Heat Sink With Improved Fin Areas And Efficiencies for Use in Cooling Various Devices, U.S. Patent No. 9,010, 405 B1 (2015)