Advanced Power Electronics and Electric Machines
NLR's advanced power electronics and electric machines research delivers safe, high-performing components and systems that control the flow of electricity among energy sources, vehicles, and the grid.
Our scientists and engineers work closely with vehicle manufacturers, suppliers, universities, and other research organizations to develop lightweight, cost-effective, power-dense technologies that advance the nation's transportation and energy systems.
Research and Development
We provide the scientific building blocks needed to spur innovation through fundamental power electronics and electric machine research and engineering.
Power Electronics Packaging
Semiconductor Power Electronics Electro-Thermal Design
Electric Motor Thermal Management
Integrated Electric Traction Drive Thermal Management
Experimentation and Modeling
Our world-class facilities and equipment enable novel experimental and modeling capabilities for advanced power electronics and electric machine design, development and performance evaluation.
Learn about our power electronics and electric machines facilities.
Electric Vehicle Innovation
Advanced transportation and energy technologies rely heavily on power electronics to distribute the proper amount and type of power between components such as batteries, inverters, converters, chargers, and electric machines. Power electronics also determine the exact nature and timing of the current and voltage waveforms to the electric machine.
NLR's research works to accelerate lightweight, compact, reliable, and high-performing systems and components. These improvements can unlock lower costs, longer lifespans, and improved performance for vehicle and energy technologies.
Publications
Conference Papers
Parameter Degradation Monitoring and Controller Adaptation Using Digital Twin, IEEE 75th Electronic Components and Technology Conference (2025)
Thermal-Mechanical Modeling of Package Reflow for Cooling of Future CPU and GPU Devices, IEEE 75th Electronic Components and Technology Conference (2025)
Organic Direct Bonded Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, IEEE Applied Power Electronics Conference and Exposition (2025)
Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge Power Module, International Microelectronics And Packaging Society Symposium (2025)
Rapid Prototyping Techniques for Organic Direct-Bonded-Copper Power Modules, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Comparative Study of the Parasitic Capacitance of Dielectric-Liquid-Cooled Power Module Designs, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Evaluation of Heat Spreading Technologies Within Double-Side-Cooled Power Modules, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Organic Direct Bonded Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, IEEE Applied Power Electronics Conference and Exposition (2025)
Journal Articles
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging-Power Die, Power Module, and Converter Level: Part 2, IEEE Transactions on Components, Packaging and Manufacturing Technology (2025)
Porous Mesh Manifold for Enhanced Boiling Performance, Applied Thermal Engineering (2025)
Thermal Modeling and Limitations for Power Electronics Embedded in Medium Voltage Cables, IEEE Transactions on Power Electronics (2025)
Trends and 2025 Insights on the Rise of Electric Vehicles in the USA, Nature Reviews Clean Technology (2025)
Thermal Performance of Triply Periodic Minimal Surface Lattice Structures in Single-Phase Dielectric Fluid Cooling of Power Electronics, ASME Journal of Heat and Mass Transfer (2025)
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures, ASME Journal of Electronic Packaging (2025)
Wide-Bandgap Semiconductor Amplifiers for Fusion Plasma Heating and Control, Fusion Science and Technology (2025)
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures, Journal of Electronic Packaging (2025)
Technical Reports
Thermal Management for Planar Package Power Electronics: Cooperative Research and Development Final Report, NLR Technical Report (2025)
Thermal Evaluation of CCS and NACS Reference Devices and Adapters, U.S. Department of Energy Technical Report (2025)
Newsletter Articles
Dielectric Fluid Cooling of Power Electronics Modules, IEEE Electronics Packaging Society (2025)
New Trends in Thermal-Fluid-Mechanical Aspects of Electronics Packaging, IEEE Thermal Mechanical Technical Committee (2025)
Power Electronics Package Construction Utilizing an Organic, Electrically Insulating Substrate Material, IEEE Thermal Mechanical Technical Committee (2025)
Presentations
Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, NLR Presentation (2025)
Posters
An Organic, Direct Bonded Copper, Multi-Layered, Ultra-Low Inductance Package for High-Power UWBG MOSFETs, NLR Poster (2025)
Conference Papers
Heat Pipe Enhanced Thermal Management System for GaN Switches in an Integrated Modular Motor Drive for Aircraft Propulsion, IEEE Energy Conversion Congress and Exposition (2024)
Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in Its Central Cavity, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application, 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2024)
A Multi-Metrics In Situ Aging Detector for SiC Power MOSFET Modules With Full Driver-Integration Capability, IEEE Applied Power Electronics Conference and Exposition (2024)
Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control, 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (2024)
Thermomechanical Degradation of Sintered Copper Under High-Temperature Thermal Shock, IEEE 74th Electronic Components and Technology Conference (2024)
Modular Coaxial Power Converter for High-Density Integration Into Medium-Voltage Cables, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (2024)
Development of a Hybrid Single/Two-Phase Capillary-Based Micro-Cooler Using Copper Inverse Opals Wick With Silicon 3D Manifold for High-Heat-Flux Cooling Application, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2024)
Multiphysics Co-Optimization Design and Analysis of Double-Side Cooled Silicon Carbide-Based Power Module, NLR Conference Paper
Pool Boiling Reliability Tests and Degradation Mechanisms of Microporous Copper Inverse Opal (CuIOs) Structures, 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2024)
Wireless Pulse-Width Modulation Control of Power Converters Using Ultra-Wideband Technology for Distributed High-Voltage Systems, NLR Conference Paper (2024)
Journal Articles
State-of-the-Art Medium- and High-Voltage Silicon Carbide Power Modules, Challenges and Mitigation Techniques: A Review, IEEE Transactions on Components, Packaging and Manufacturing Technology (2024)
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging – Power Die, Power Module, and Converter Level – Part 1, IEEE Transactions on Components, Packaging and Manufacturing Technology (2024)
Capillary-Enhanced Two-Phase Micro-Cooler Using Copper-Inverse-Opal Wick With Silicon Microchannel Manifold for High-Heat-Flux Cooling Application, International Communications in Heat and Mass Transfer (2024)
Presentations
Advanced Packaging Designs (Keystone Project 1), NLR Presentation
Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments, NLR Presentation (2024)
Integrated Traction Drive Thermal Management: Keystone Project 3, NLR Presentation (2024)
Tutorial – Electric Motor and Integrated Traction Drive Thermal Management, NLR Presentation (2024)
Posters
Power Module Precursors and Prognostics, NLR Poster (2024)
Power Electronics Materials and Bonded Interfaces – Reliability and Lifetime, NLR Poster (2024)
Power Electronics Thermal Management, NLR Poster (2024)
Electric Motor Thermal Management, NLR Poster (2024)
Power Module Precursors and Prognostics, NLR Poster (2024)
Contacts
Group Manager, Advanced Power Electronics and Electric Machines
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Last Updated Dec. 22, 2025