Douglas DeVoto leads reliability evaluation and prognostics research for automotive power electronics with a focus on bonded interfaces, electrical interconnects, and high-temperature packaging within NREL's power electronics and electric machines group. He is experienced with accelerated testing, thermal and thermomechanical finite element analysis modeling, and developing strategies to improve the reliability of innovative power electronics for electric-drive vehicles and other applications.

Research Interests

Power electronics packaging

Reliability and prognostics

Education

M.S., Mechanical Engineering, University of Maryland

B.S., Mechanical Engineering, The University of Delaware

Professional Experience

Senior Research Engineer, Center for Integrated Mobility Sciences, NREL (2010–present)

Graduate Researcher, University of Maryland (2008–2010)

Associations and Memberships

Member, American Society of Mechanical Engineers

Senior Member, Institute of Electrical and Electronics Engineers

Featured Work

Reliability and Lifetime Prediction Model of Sintered Silver under High-Temperature Cycling, IEEE Journal of Emerging and Selected Topics in Power Electronics (2022)

Reliability Analysis of Large-Area, Low Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules, IEEE Journal of Emerging and Selected Topics in Power Electronics (2022)

Bond Wire Damage Detection and SOH Estimation of a Dual-Pack IGBT Power Module Using Active Power Cycling and Reflectometry, IEEE Transactions on Power Electronics (2020)

Analysis and Optimization of a Multi-Layer Integrated Organic Substrate for High Current GaN HEMT-Based Power Module, IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA) (2020)

Experimental Characterization and Modeling of Thermal Resistance of Electric Machine Lamination Stacks, International Journal of Heat and Mass Transfer (2019)

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages, ASME Journal of Electronic Packaging (2019)

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices, IEEE Transactions on Power Electronics (2019)

Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses, Proceedings of the 10th International Conference on Integrated Power Electronics Systems (CIPS) (2018)

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments, IEEE Transactions on Components, Packaging and Manufacturing Technology (2016)

Gaining Traction: Thermal Management and Reliability of Automotive Electric Traction-Drive Systems, IEEE Electrification Magazine (2014)

Patents

Power Electronics Module with Integrated Ceramic Heat Exchanger, Non-Provisional Patent Application 63/483,041 (filed 2023)

Awards and Honors

Excellence in Mechanics Award, American Society of Mechanical Engineers, Electronic and Photonic Packaging Division (2023)

Distinguished Achievement Award, U.S. Department of Energy Vehicle Technologies Office (2023)

Outstanding Performance Staff Award, NREL (2017)

R&D 100 Award with Wolfspeed, Toyota, and the University of Arkansas, R&D Magazine (2016)

Outstanding Mentor Award, NREL (2016)

Outstanding Paper Award, Second Place, ASME InterPACK Conference (2013)

Outstanding Business Collaboration Award, NREL (2013)