Materials Characterization

Method: X-Ray Fluorescence (XRF)
Instrument: Fisher XDV XRF
Measures: Composition and thickness
Samples: <12" square
Resolution: 0.3-3 mm
Time per point: 3-5 min
Features: Ti lightest element

Method: X-Ray Fluorescence (XRF)
Instrument: Fisher XUV XRF
Measures: Composition and thickness
Samples: <6" square
Resolution: 0.3-3 mm
Time per point: 3-5 min
Features: >Al, vacuum

Method: X-Ray Fluorescence (XRF)
Instrument: Bruker Tornado XRF
Measures: Composition and thickness
Samples: <6" square
Resolution: 0.01-3 mm
Time per point: 3-5 min
Features: >Al, vacuum, micro

Method: Wavelength dispersive X-ray fluorescence (WD-XRF)
Instrument: Rigaku Primus-IV WD-XRF
Measures: Composition and thickness
Samples: 24 x <2" square
Resolution: ~3 mm
Time per point: ~10 min
Features: C lightest element. Mapping capability. Can measure composition of light anions (e.g., N, O).

Method: Rutherford Back Scattering (RBS)
Instrument: National Electrostatics Corp RBS
Measures: Composition and thickness
Samples: <2" square
Resolution: 1 mm
Time per point: 30 min
Features: >N, vacuum

Method: X-Ray Diffraction (XRD)
Instrument: Bruker D8 Discover XRD
Measures: Structure and phase content
Samples: <4" square
Resolution: 1-2 mm
Time per point: 3-5 min
Features: 2D detector

Method: High-Resolution X-Ray Diffraction and Reflectivity (XRD)
Instrument: Rigaku Smartlab
Measures: Epitaxial film crystal structure, orientation, quality, and thickness
Samples: <4" circle
Resolution: 1-2 mm
Time per point: Depends on measurement, typically 60 min per point
Features: 2D detector, high resolution optics, heated stage to 1100 °C.

Method: Single Crystal X-Rray Diffraction (SCXRD)
Instrument: Bruker D8 Venture Ga MetalJet
Measures: Single crystal structures, capillaries, thin films, and high pressure experiments in diamond anvil cells
Samples: minimum crystals ~10 microns
Resolution: n/a
Time per point: Depends on measurement, typically 5-10 min per capillary and 20-300 min per single crystals
Features: 2D detector, high resolution optics, and cryostream 80–400K

Method: Raman and Photoluminescence
Instrument: Renishaw in Via Raman Microscope
Measures: Vibration modes and phase ID
Samples: <2" square
Resolution: 1 um
Time per point: 5 min
Features: Multiple lasers

Method: Optical Spectroscopy
Instrument: Custom with Ocean Optics Spectrometer
Measures: Bandgap and absorption coefficient
Samples: <6" square
Resolution: 1 mm
Time per point: 3 sec
Features: Diffuse and specular ultraviolet visible spectroscopy (UV-Vis-NIR)

Method: Spectroscopic Ellipsometry
Instrument: J.A. Woollam Ellipsometer
Measures: Thickness and refractive index
Samples: <6" square
Resolution: 1 mm
Time per point: 10 sec
Features: Variable angle and UV-VIS-NIR

Method: Fourier Transform Infrared Spectroscopy (FTIR)
Instrument: Thermo Scientific FTIR
Measures: Plasmons and vibrations
Samples: <6" square
Resolution: 3 mm
Time per point: 5 sec
Features: 1.8-25 um

Method: Colorimetry
Instrument: Epson Perfection V850 photo scanner
Measures: Film images and color
Samples: <8" square
Resolution: 1 um
Time per point: <1 sec
Features: Custom holder and software

Method: 4-Point Probe
Instrument: Custom 4-point probe
Measures: sheet resistance
Samples: 2" square
Resolution: 3 mm
Time per point: 15 sec
Features: Heaters for measuring Seebeck

Method: Two-Terminal Measurements
Instrument: Custom JV/CV/IS
Measures: Resistance, capacitance, and impedance
Samples: <6" square
Resolution: 1 mm
Time per point: 5-30 sec
Features: Solar simulator and T/ambient control

Method: IV-CV Sweeping and Multiterminal Measurements
Instrument: Keithley 4200
Measures: Transistor and capacitor characteristics
Samples: <3" square
Resolution: 1 mm
Time per point: 10 min
Features: Microscope probe station

Method: Cryogenic Environment Probing
Instrument: LakeShore 8425 Probing Station
Measures: 2, 3, and 4 terminal electrical measurements, including Hall effect, with in-situ probing
Samples: up to 4 x 1cm square (or similar)
Resolution: NA
Time per point: Depends
Features: 10K–400K sample environment with ≤2 Tesla magnet and up to 6 in-situ probes. Capabilities include gated measurements, fully triaxial shielded cabling, electrometer, picoammeter, and nanovoltmeter for difficult measurements/samples

Method: Magneto Optical Kerr effect
Instrument: Durham MagnetoOptics NanoMOKE3 Wafer Mapper effect
Measures: Magnetic hysteresis loops and domain Imaging effect
Samples: <8" round effect
Resolution: <10 μm effect
Time per point: 30 sec effect
Features: Holders and analysis software for full wafer mapping from ambient to ~400°C

Method: Magnetometry, Heat capacity, Thermal Conductivity, Electrical Transport, and Optical Properties
Instrument: Quantum Design Physical Properties Measurement System
Measures: AC susceptibility and DC magnetization (including under illumination); heat capacity, thermal conductivity, electrical transport (including a rotator), and magneto-PL
Samples: <5mm square
Resolution: NA
Time per point: Depends
Features: 14 Tesla magnet, temperatures from 1.8–400K

Method: Kelvin Probe measurement
Instrument: KP Technology measurement
Measures: Work function and surface photovoltage measurement
Samples: <6" square measurement
Resolution: 1 mm measurement
Time per point: 10 sec measurement
Features: Variable angle and UV-ViS-NIR

Method: Thickness Profilometry
Instrument: Dektak Profilometer
Measures: Film thickness
Samples: <6" round
Resolution: 1 um
Time per point: 30 sec
Features: Holders and analysis software for full wafer mapping

Method: Scanning Droplet Cell (SDC) Mapping
Instrument: Custom SDC instrument
Measures: Cyclic voltammetry and photocurrent
Samples: <2" square
Resolution: 2 mm
Time per point: 30 sec
Features: Corrosion testing and LED-based light

Method: Contact Angle Measurement
Instrument: Kruss-Scientific
Measures: Contact angle
Samples: <6" square
Resolution: 3 mm
Time per point: 15 sec
Features: Custom solutions